Solder Zvishandiso zveLaser Diode Bhara: Iyo Yakakosha Bridge Pakati Pekuita uye Kuvimbika.

Mukugadzira uye kugadzirwa kweakakwira-simba semiconductor lasers, laser diode mabara anoshanda sepakati mwenje-emitting units. Kuita kwavo kunoenderana kwete chete nemukati hunhu hwemalaser machipisi asiwo zvakanyanya pane yekurongedza. Pakati pezvakasiyana-siyana zvinosanganisirwa mukurongedza, solder zvinhu zvinoita basa rakakosha seyekupisa uye yemagetsi interface pakati pe chip uye sink yekupisa.

1. Basa reSolder muLaser Diode Bars

Laser diode mabara anowanzo batanidza akawanda emitters, zvichikonzera kuwanda kwemagetsi uye kuomesesa kwemafuta manejimendi zvinodiwa. Kuti uwane kunyatsopisa kupisa uye kugadzikana kwechimiro, solder zvinhu zvinofanirwa kuzadzisa zvinotevera maitiro:

① High thermal conductivity:

Inova nechokwadi chekufambisa kupisa kwakanaka kubva kune laser chip.

② Kunyorova kwakanaka:

Inopa kubatana kwakasimba pakati pechip uye substrate.

③ Nzvimbo yekunyungudika yakakodzera:

Inodzivirira kuyerera kana kudzikisira panguva inotevera yekugadzirisa kana kushanda.

④ Inoenderana coefficient yekuwedzera kwekupisa (CTE):

Inoderedza kushushikana kwekushisa pane chip.

⑤ Yakanakisa kuneta kuramba:

Inowedzera hupenyu hwebasa remudziyo.

2. Common Types Solder nokuti Laser Bar Packaging

Aya anotevera ndiwo matatu makuru emhando dze solder zvinhu zvinowanzoshandiswa mukurongedza kwelaser diode bars:

①Goridhe-Tin Alloy (AuSn)

Properties:

Eutectic kuumbwa kwe80Au/20Sn ine nzvimbo yekunyungudika ye280°C; high thermal conductivity uye simba remagetsi.

Zvakanakira:

Yakanakisa kugadzikana kwepamusoro-tembiricha, hupenyu hurefu hwekuneta, husina kusvibiswa kweorganic, kuvimbika kwakanyanya.

Applications:

Mauto, aerospace, uye yepamusoro-yekupedzisira maindasitiri laser masisitimu.

②Pure Indian (In)

Properties:

Kunyunguduka kwe157 ° C; yakapfava uye inogoneka zvakanyanya.

Zvakanakira:

Superior thermal cycling performance, yakaderera kushushikana pane chip, yakanakira kuchengetedza zvimiro zvisina kusimba, yakakodzera kune yakaderera-tembiricha yekubatanidza zvinodiwa.

Kuganhurirwa:

Inotarisana ne oxidation; inoda inert mhepo panguva yekugadzirisa, yakaderera mechanical simba; haina kunaka kune yakakwira-load application

③Composite Solder Systems (semuenzaniso, AuSn + In)

Chimiro:

Kazhinji, AuSn inoshandiswa pasi peiyo chip yekunamatira yakasimba, nepo In inoiswa pamusoro kuti iwedzere kupisa kwekupisa.

Zvakanakira:

Inosanganisa kuvimbika kwepamusoro nekurerutsa kushushikana, inovandudza kusimba kwekurongedza, inogadzirisa zvakanaka kune dzakasiyana siyana dzekushanda nharaunda.

3. Mhedzisiro yeSolder Quality paChigadzirwa Chinoshanda

Kusarudzwa kwezvinhu zvekutengesa uye kudzora kwemaitiro kunokanganisa zvakanyanya kuita kwe electro-optical uye kugadzikana kwenguva refu kwemidziyo yelaser:

Pasi pesimba repamusoro-soro rinoenderera mberi kushanda, kunyangwe zvidiki zvidiki mukutengesa zvinogona kutungamira mukupisa kwekuvaka, zvichikonzera kuderedzwa kwekuita kana kutadza kwechishandiso. Naizvozvo, kusarudza yemhando yepamusoro solder uye kuita chaiyo solder maitiro akakosha pakuwana yakakwirira-yakavimbika laser packaging.

4. Future Trends uye Development

Sezvo laser tekinoroji ichiramba ichipinda mukugadziriswa kwemaindasitiri, kuvhiyiwa kwekurapa, LiDAR, nedzimwe minda, solder zvinhu zvelaser packaging zviri kubuda nenzira inotevera:

①Low-tembiricha soldering:

Kubatanidzwa nezvinhu zvinopisa zvinopisa

②Lead-isina solder:

Kusangana neRoHS nemimwe mitemo yezvakatipoteredza

③High-performance thermal interface zvinhu (TIM):

Kuti uwedzere kuderedza kupisa kwekupisa

④Micro-soldering tekinoroji:

Kutsigira miniaturization uye yakakwirira-density kubatanidzwa

5. Mhedziso

Kunyangwe zvidiki muhukuru, solder zvinhu ndizvo zvakakosha zvinongedzo zvinosimbisa kuita uye kuvimbika kweakakwira-simba laser zvishandiso. Mukurongedzerwa kwelaser diode mabara, kusarudza iyo solder yakakodzera uye optimize iyo bonding maitiro kwakakosha kuti uwane kushanda kwakasimba kwenguva refu.

6. Nezvedu

Lumispot yakazvipira kupa vatengi vane hunyanzvi uye hwakavimbika laser zvikamu uye yekurongedza mhinduro. Tine ruzivo rwakakura mukusarudza zvinhu zvekutengesa, dhizaini yekudziya manejimendi, uye kuongororwa kwekuvimbika, tinotenda kuti kukwenenzvera kwega kwega kunovhura nzira yekunaka. Kuti uwane rumwe ruzivo nezve yakakwirira-simba laser packaging tekinoroji, inzwa wakasununguka kutibata nesu.