Bata Conduction Kutonhodza: ​​Iyo "Calm Path" yeHigh-Simba Laser Diode Bar Application

Sezvo yakakwirira-simba laser tekinoroji iri kuramba ichifambira mberi nekukurumidza, maLaser Diode Bars (LDBs) ave kushandiswa zvakanyanya mukugadzirwa kwemaindasitiri, kuvhiyiwa kwekurapa, LiDAR, uye kutsvagisa kwesainzi nekuda kwehurefu hwesimba uye kupenya kwakanyanya. Nekudaro, nekuwedzera kwekubatanidza uye kushanda kwazvino kwelaser machipisi, zvipingamupinyi zvekutonga zvinopisa zviri kuwedzera kusimba-zvichikanganisa kugadzikana kwekuita uye hupenyu hwese laser.

Pakati peakasiyana siyana ekudziya ekutonga matangi, Bata Conduction Kutonhodza inomira pachena seimwe yeakanyanya kukosha uye yakagamuchirwa hunyanzvi hunyanzvi mulaser diode bar kurongedza, nekuda kwechimiro chayo chakareruka uye yakakwirira yekupisa conductivity. Ichi chinyorwa chinoongorora misimboti, yakakosha dhizaini kufunga, kusarudzwa kwezvinhu, uye mafambiro emangwana eiyi "nzira yakadzikama" yekudzora kupisa.

接触传导散热

1. Nheyo dzeBata Conduction Kutonhora

Sezvinoratidzwa nezita racho, kubata conduction kutonhora kunoshanda nekumisikidza kusangana kwakananga pakati pelaser chip uye sink yekupisa, ichigonesa kufambiswa kwekushisa kwakanaka kuburikidza nemhando yepamusoro yekupisa conductivity zvinhu uye kukurumidza kuparara kune yekunze nharaunda.

The HkudyaPath:

Mune yakajairwa laser diode bar, nzira yekupisa yakaita seiyi:
Chip → Solder Layer → Submount (semuenzaniso, mhangura kana ceramic) → TEC (Thermoelectric Cooler) kana Heat Sink → Ambient Environment

Features:

Iyi nzira yekutonhora inosanganisira:

Concentrated heat flow and short thermal path, inonyatso kudzikisa tembiricha yejunction; Compact design, yakakodzera miniaturized packaging; Passive conduction, inoda pasina yakaoma inoshanda kutonhora zvishwe.

2. Yakakosha Dhizaini Mafungiro eThermal Performance

Kuti uve nechokwadi chekubata kutonhora kutonhora, zvinotevera zvinofanirwa kutariswa panguva yekugadzira mudziyo:

① Thermal Resistance paSolder Interface

Iyo yekupisa conductivity ye solder layer inobata basa rakakosha mukupisa kwese kupikisa. High-conductivity simbi dzakadai seAuSn alloy kana pure indium inofanira kushandiswa, uye solder layer gobvu uye kufanana kunofanira kudzorwa kuti kuderedze zvipingamupinyi zvinopisa.

② Submount Material Selection

Common submount zvinhu zvinosanganisira:

Mhangura (Cu): High thermal conductivity, inodhura-inoshanda;

Tungsten Copper (WCu)/Molybdenum Copper (MoCu): Zvirinani CTE match nemachipisi, ichipa zvese simba uye conductivity;

Aluminium Nitride (AlN): Yakanakisa kuvharwa kwemagetsi, yakakodzera kune yakakwira-voltage application.

③ Surface Kubata Hunhu

Kushata kwepamusoro, kupfava, uye kunyorova zvinokanganisa zvakananga kutamisa kupisa. Kupenya uye goridhe plating inowanzo shandiswa kuvandudza kupisa kwekubata kuita.

④ Kuderedza Thermal Path

Iyo dhizaini yekugadzira inofanirwa kupfupisa nzira yekupisa pakati pechip uye sink yekupisa. Dzivisa zvisingakoshi zvepakati zvinhu maseru kuti uvandudze huwandu hwekupisa kupisa kunyatsoshanda.

3. Remangwana Rekuvandudza Madirections

Nemaitiro arikuenderera mberi akananga kuminiaturization uye yakakwirira simba density, kuonana conduction kutonhora tekinoroji iri kubuda nenzira dzinotevera:

① Multi-layer Composite TIMs

Kubatanidza simbi yekupisa yekupisa ine flexible buffering kuderedza interface kuramba uye kunatsiridza kupisa kusimba kwebhasikoro.

② Yakabatanidzwa Heat Sink Packaging

Kugadzira ma submounts uye kupisa kunyura sechinhu chimwe chete chakabatanidzwa kuti kuderedze nzvimbo dzekusangana uye kuwedzera system-level kupisa kupisa kunyatsoshanda.

③ Bionic Structure Optimization

Kushandisa zvimiro zvine microstructured zvinotevedzera nzira dzechisikigo dzekubvisa kupisa-senge "muti-kufanana conduction" kana "scale-like mapatani" -kukwidziridza kuita kwekupisa.

④ Intelligent Thermal Control

Kubatanidza tembiricha sensors uye inosimba simba rekudzora kune adaptive thermal manejimendi, kuwedzera hupenyu hwekushanda hwechishandiso.

4. Mhedziso

Kune epamusoro-simba laser diode mabara, yekupisa manejimendi haingori dambudziko rehunyanzvi-ndiyo hwaro hwakakosha hwekuvimbika. Bata conduction kutonhora, ine hunhu hwayo hunoshanda, hwakura, uye husingadhuri, inoramba iri imwe yemhinduro huru dzekupisa kupisa nhasi.

5. Nezvedu

PaLumispot, tinounza hunyanzvi hwakadzama mulaser diode packaging, thermal management ongororo, uye kusarudzwa kwezvinhu. Basa redu nderekupa kushanda kwepamusoro, kwenguva refu-yeupenyu laser mhinduro dzakanangana nezvido zvako zvekushandisa. Kana muchida kudzidza zvakawanda, tinokugamuchirai nemufaro kuti mubate nechikwata chedu.


Nguva yekutumira: Jun-23-2025